HS-Code
Products
3824999900
07020132 #&MICROFILL (TM) THF CARRIER SOLUTION CONTAINS 80-90% WATER; SULFURIC ACID0.1- <1%; COPPER SULFATE0.1- <1%; OXYALKYLENE POLYMER1- <10% USED IN ELECTROPLATING SYSTEM-20L/ T. 100% NEW
3824999900
07020132 #&MICROFILL (TM) THF CARRIER SOLUTION CONTAINS 80-90% WATER; SULFURIC ACID0.1- <1%; COPPER SULFATE0.1- <1%; OXYALKYLENE POLYMER1- <10% USED IN ELECTROPLATING TECHNOLOGY-20L/ T NEW 100%
3824999900
07020329 #&COPPER GLEAM SOLUTION (TM) HS-200B-1 (J) USED IN PLATING 0.1-1% COPPER SULFATE OXYALKYLENE POLYMER 15-25% SULFURIC ACID 0.1-1% AND WATER 75-85% FOR USE IN THE ELECTRONICS INDUSTRY -20L/ T. 100% NEW
HS-Code
Products
3824999900
07020123 # & MICROFILL SOLUTION EVF LEVELER SOLUTION CONTAINS 90-99% OXYALKYLENE POLYMER <1% SULFURIC ACID 1-5% COPPER SULFATE <1% USED IN PLATING TECHNOLOGY - 20L / T. 100%
3824999900
07020132 # & MICROFILL (TM) CARRIER SOLUTION THF CONTAINING 80-90% WATER; SULFURIC ACID0.1- <1%; COPPER SULFATE0.1- <1%; OXYALKYLENE POLYMER1 - <= 10% USED IN ELECTROPLATING TECHNOLOGY-20L / T.NEW 100%
3824999900
07020123 # & MICROFILL EVF SOLUTION LEVELER 90-99% AQUEOUS SOLUTION OXYALKYLENE POLYMER <1% SULFURIC ACID 1-5% COPPER SULFATE <1% USED IN ELECTROPLATING TECHNOLOGY-20L / T.NEW 100%
HS-Code
Products
3824999900
MICROFILL EVF LEVELER SOLUTION CONTAINS 90-99% WATER OXYALKYLENE POLYMER <1% SULFURIC ACID 1-5% COPPER SULFATE <1% USED IN ELECTROPLATING TECHNOLOGY.
3824999900
COPPER GLEAM HV-101 A SOLUTION CONTAINS >95% WATER AZOLE POLYMER 1-5% FORMALDEHYDE 0.1-<1.0% COPPER SULFATE 0.1-<1.0% SULFURIC ACID 0.1-<1.0% USED IN ELECTROPLATING TECHNOLOGY. 100% NEW
3824999900
COPPER GLEAM HV-101 A SOLUTION CONTAINS >95% WATER AZOLE POLYMER 1-5% FORMALDEHYDE 0.1-<1.0% COPPER SULFATE 0.1-<1.0% SULFURIC ACID 0.1-<1.0% USED IN ELECTROPLATING TECHNOLOGY. 100% NEW
HS-Code
Products
3824999900
MIXTURES OF INORGANIC COMPOUNDS AND ORGANIC POWDER THE MAIN INGREDIENT IS CALCIUM CARBONATE BARIUM SULFATE POLYMERS - COMPOUND POWDER-JA3 (KQGD: 2080 / TBTCHQ DATED 03.22.2016) . 100% NEW
3824999900
MIXTURES OF INORGANIC COMPOUNDS AND ORGANIC POWDER THE MAIN INGREDIENT IS CALCIUM CARBONATE BARIUM SULFATE POLYMER CREATING FRICTION - COMPOUND POWDER-2F8 (KQGD: KQGD: 2079 / TBTCHQ DATED 22.03.2016) . NEW 100%
3824999900
THE MIXTURE OF INORGANIC AND ORGANIC COMPOUNDS WITH THE MAIN INGREDIENT IS BARI SULFATE GRAPHITE POLYMERS CREATING FRICTION-COMPOUND POWDER-N95B (RESULTS: 480/TB-K?3 DAY07/10/2016) (CAS 9003- 35-4)
HS-Code
Products
38249999
CPG.#&CHEMICAL PRODUCT B80 ZNO (THE MAIN INGREDIENT IS ZINC OXIDE POLYMER GRANULAR USED IN THE PRODUCTION OF SHOES AND SANDALS 100% BRAND NEW.
3824999900
CPG # & CHEMICAL PREPARATIONS B50 ZNO (WITH MAIN COMPONENTS ARE ZINC OXIDE POLYMERS GRANULAR) USED IN SHOE PRODUCTION AND SLIPPERS
3824999900
CPG # & CHEMICAL PREPARATIONS B50 ZNO (WITH MAIN COMPONENTS ARE ZINC OXIDE POLYMERS GRANULAR) USED IN SHOE PRODUCTION AND SLIPPERS
HS-Code
Products
3824999900
A / 16.4 - ZINC OXIDE IN THE POLYMER CARRIER IS USED AS ADDITIVE IN ZINC OXIDE-80 CAUGHT TARBALLS CLH MASTER BATCH OF 103 683 644 520 TK / E31 DATED 26.11.2020 SECTION 4
3824999900
A/16.4 ZINC OXIDE IN THE CARRIER IS A POLYMER USED AS AN ADDITIVE IN THE PLASTICS INDUSTRY- ZINC OXIDE-80 MASTER BATCH CAS: 1314-13-2 25038-36-2 CLH ACCORDING TO TK NUMBER::105381613520/E31.7/4 2023 ITEM 1
3824999900
A/16.4#&ZINC OXIDE IN THE CARRIER IS A POLYMER USED AS AN ADDITIVE IN THE PLASTIC INDUSTRY- ZINC OXIDE-80 MASTER BATCH CAS: 1314-13-2 25038-36-2(541/PTPLHCM-NV 07/03// 2013) (NPL MANUFACTURES SHOES)
HS-Code
Products
3824999900
CUSO4 CLEANING SOLUTION ADHESIVE ON THE SURFACE OF THE PRODUCT AFTER THE COPPER GALVANIZED COPPER GLEAM HVS-202B (J) (WATER 85-95%; POLYALKYLENE GLYCOL 5-15%; POLYMER 1-5%; SULFURIC ACID 0.1-1% ; COPPER SULFATE 0.1-1%)
3824999900
MICROFILL EVF LEVELER SOLUTION SOLUTION CONTAINS A 90-99% WATER OXYALKYLENE POLYMER <1% SULFURIC ACID 1-5% COPPER SULFATE <1% USED IN ELECTROPLATING TECHNOLOGY. 100% NEW
3824999900
COPPER GLEAM SOLUTION (TM) HS-200B-1 (J) USED IN PLATING COPPER SULPHATE 0.1-1% OXYALKYLENE POLYMER 15-25% SULFURIC ACID 0.1-1% AND WATER 75-85% USE IN ELECTRONICS INDUSTRY
HS-Code
Products
3824999900
FS-15883 # & CHEMICALS KURIVERTER N-500H (ORGANIC POLYMER AND PHOSPONATE) USED IN WASTEWATER TREATMENT
3824999900
FS-17102#&CHEMICAL KURIVERTER N-500 (ORGANIC POLYMER AND PHOSPONATE) USED IN WASTEWATER TREATMENT
3824999900
FS-17102#&CHEMICAL KURIVERTER N-500 (ORGANIC POLYMER AND PHOSPONATE) USED IN WASTEWATER TREATMENT
HS-Code
Products
3824999900
CHEMICAL PRODUCT KURIFLOAT K-320 USED IN BOILER WATER TREATMENT INDUSTRY LIQUID FORM TPHH: SODIUM HEXAMETAPHOSPHATE 80-95% 10124-56-8 ORGANIC POLYMER 1-5% 9003-04-7 ANTI- CAKE AGENT 1-5%
382499990000
SCALE INHIBITOR ANTI-CORROSION SLUDGE DISPERSANT FOR INDUSTRIAL OPEN CIRCULATING COOLING WATER SYSTEMS KURITA S-7310 ORGANIC POLYMER COMPOUND 10-20% PHOSPHORIC ACID 7664-38-2 10-20%
3824999900
CHEMICAL PRODUCT KURIFLOAT K-320 USED IN BOILER WATER TREATMENT INDUSTRY LIQUID FORM TPHH: SODIUM HEXAMETAPHOSPHATE 80-95% 10124-56-8 ORGANIC POLYMER ANTI-CAKE AGENT 100% NEW
HS-Code
Products
3824999900
0 # & CUSO4 CLEANING SOLUTION STICK ON THE SURFACE OF THE PRODUCT AFTER PLATING COPPER COPPER GLEAM HVS-202B (J) (WATER 85-95%; POLYALKYLENE GLYCOL 5-15%; POLYMER 1-5%; SULFURIC ACID 0.1 -1%; COPPER SULFATE 0.1-1%)
3824999900
0 # & CLEANING SOLUTION CUSO4 STICKY SURFACE AFTER COPPER PRODUCTS COPPER GLEAM HVS-202B (J) (85-95% WATER; POLYALKYLENE GLYCOL 5-15% POLYMER 1-5% SULFURIC ACID 0.1 -1%; COPPER SULFATE FROM 0.1 TO 1%)
3824999900
0 # & COPPER GLEAM (TM) SOLUTION (TM) HS-200B-1 (J) USED IN PLATING CONTAINING COPPER SULPHATE 0.1-1% OXYALKYLENE POLYMER 15-25% SULPHURIC ACID 0.1-1% AND WATER 75-85% USED IN ELECTRONICS INDUSTRY 100% NEW
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