HS-Code
Products
980200000000
JASMONIC ACID (MIXTURE OF ISOMERS)
980200000000
JASMONIC ACID (MIXTURE OF ISOMERS)
980200000000
D-ARABOASCORBIC ACID(500GX1)ORIGIN: JAPAN
HS-Code
Products
382499990000
0 # & CLEANING SOLUTION CUSO4 STICKY SURFACE AFTER COPPER PRODUCTS COPPER GLEAM HVS-202B (J) (85-95% WATER; POLYALKYLENE GLYCOL 5-15% POLYMER 1-5% SULFURIC ACID 0.1 -1%; COPPER SULFATE FROM 0.1 TO 1%)
382499990000
07020329 # & DUNGPOPPER COPPER GLEAM (TM) HS-200B-1 (J) USED IN PLATING COPPER SULPHATE 0.1-1% OXYALKYLENE POLYMER 15-25% SULFURIC ACID0.1-1% AND WATER75-85% USE IN ELECTRONIC INDUSTRY-20L / T.NUMBER 100%
382499990000
0 # & LIQUID COPPER GLEAM (TM) HS-200B-1 (J) USED IN PLATING CONTAINING 0.1-1% COPPER SULPHATE OXYALKYLENE POLYMER 15-25% FROM 0.1 TO 1% SULFURIC ACID AND WATER 75-85% USED IN ELECTRONICS INDUSTRY
HS-Code
Products
382499990000
SURFACE BRIGHTENING SURFACE AFTER PLATING COPPER GLEAM HVS-202A (J) (WATER 90-99%; FORMALDEHYDE 0.1-1%; ORGANIC SULFUR COMPOUND 0.1-1%; SULFURIC ACID 0.1-1% ; COPPER SULFATE 0.1-1%)
382499990000
SURFACE LIGHTENER AFTER COPPER GLEAM HVS-202A (J) COPPER PLATING (WATER 90-99%; FORMALDEHYDE 0.1-1%; ORGANIC SULFUR COMPOUND 0.1-1%; SULFURIC ACID 0.1-1% COPPER SULFATE 0.1-1%)
382499990000
SURFACE BRIGHTENING SOLUTION AFTER COPPER GALVANIZING COPPER GLEAM HVS-202A (J) (WATER 90-99%; FORMALDEHYDE 0.1-1%; ORGANIC SULFUR COMPOUND 0.1-1%; SULFURIC ACID 0.1-1% ; COPPER SULFATE 0.1-1%) 100% NEW
HS-Code
Products
280610000000
J04128 #& HYDROCHLORIC ACID SOLUTION USED AS AN ASSEMBLY OF CU PLATING ON THE INTEGRATED CIRCUIT (500 ML/BT)-1MOL/L HYDROCHLORIC ACID [HCL 3.58% CAS 7647-01-0]
280700000000
J03907 # & DENSE SULFURIC ACID SOLUTION USED TO CORRODE METAL LAYERS ON INTEGRATED CIRCUITS (6 KGS / BT) - SULFURIC ACID [H2SO4 95% CAS 7664-93-9]. SECTION 6 GPNK 6391 / TCCN2021 / GP-HC (JULY 12 2021)
283620000000
J03915 # & DINATRON CARBONATION USED TO ADJUST THE ACID CONCENTRATION OF CORROSION - SODA ASH [NA2CO3 99% CAS 497-19-8]
HS-Code
Products
382499990000
07020113 # & JC-BRITE 211SF: CHEMICAL PREPARATIONS USED IN INDUSTRIAL PLATING WITH T / P ARE SULPHATE SALTS AND ADDITIVES IN ACIDIC ENVIRONMENTS. NEW 100%
382499990000
07020112 # & JC-BRITE 201MU: PREPARATIONS USED IN PLATING IN THE MAIN INGREDIENT ARE POLYOXYALKYLENE AND ADDITIVES IN ACIDIC ENVIRONMENT (SULFURIC ACID 0.7% POLYOXYALKYLYLENE ETHER ETHER 19.4%). NEW 100%
382499990000
07020112 # & JC-BRITE 201MU: PREPARATIONS USED IN PLATING WITH POLYOXYALKYLYLENE AND ADDITIVES IN ACIDIC ACIDS (SULFURIC ACID 0.7% POLYOXYALKYLYLENE ETHER ETHER 19.4%) 100% NEW.
HS-Code
Products
382499990000
CHEMICAL PREPARATIONS USED IN PLATING STABILIZING AND EVENING COLOR TAC STABILIZER MAIN INGREDIENT AMMONIUM HEXAFLUOROZIRCONATE. ACETIC ACID SODIUM NITRATE (CAS: 16919-31-6 64-19-7 7631-99-4)20LT/ CAN NXS OKUNO JP 100% NEW
320412100000
POWDERED ACIDIC DYE PREPARATIONS MAIN COMPONENTS INCLUDE COMPLEX CHROMIUM OF AZO DYES SODIUM ACETATE SILICON / TAC BLACK GLH (402) 1KG / 1 BOX NEW 100% # & JP
320412100000
POWDERED ACIDIC DYE PREPARATIONS MAIN COMPONENTS INCLUDE COMPLEX CHROMIUM OF AZO DYES SODIUM ACETATE SILICON / TAC BLACK GBLH (413) CAS 74920-95-9 NEW 100% # & JP
HS-Code
Products
382499990000
008000092W#& FE -200 - A MIXTURE OF IRON CHLORIDE HYDROCHLORIC ACID IN WATER LIQUID (LIQUID)#& JP
382499990000
008.000092W#&FE-200 - MIXTURE OF IRON CHLORIDE HYDROCHLORIC ACID IN WATER LIQUID (LIQUID)#&JP
382499999000
008000092W#&FE-200 - MIXTURE OF IRON CHLORIDE HYDROCHLORIC ACID IN WATER LIQUID (LIQUID)#&JP
HS-Code
Products
283340000000
. # & CP FINISHING METAL SURFACE BASED ON ACID MELPOLISH COPPER 61A (DIPOTASSIUM PEROXODISULFATE POTASSIUM HYDROGEN SULFATE INORGANIC ACID SALT) (20KG / BAG). 100% NEW GOODS # & JP
290410000000
.#&METAL SURFACE FINISHING PRODUCT BASED ON MELPOLISH COPPER 61B ACID (INGREDIENTS: SULFURIC ACID 1-10%% METHANESULFONIC ACID 2% WATER 85-95%)(20L/CAN).100% BRAND NEW# &JP
382499999000
. # & PREPARATIONS FOR CHEMICAL ANALYSIS IN EXPERIMENTS (GOLD STANDARD SOLUTION) (INGREDIENTS: HYDROGEN TETRACHLOROAURATE (III) HYDROCHLORIC ACID 3.6%) (100 ML / EA) 100% NEW GOODS # & JP
HS-Code
Products
291719000000
HC7 # & FLUIDS METALIZED CT-3. TP: SULFOBUTANEDIOIC 1 4BIS ACID (2ETHYLHEXYL) ESTER SODIUM SALT JX NIPPON MINING-CAS 577-11-7.NSX & METALS CORPORATION ISOHARA WORKS. NEW 100%
291814000000
HC11 # & CRYSTAL POWDER USED IN METAL PLATING ADJUSTMENT ACID. CITY: ORGANIC ACID> 99% - CAS 5949-29-1. NSX ELECTROPLATING ENGINEERS OF JAPAN LTD. USED IN METAL PLATING INDUSTRY. 100% NEW.
291814000000
HC11 # & CRYSTAL POWDER USED IN METAL PLATING ADJUSTMENT ACID. CITY: ORGANIC ACID> 99% CAS 5949-29-1. NSX ELECTROPLATING ENGINEERS OF JAPAN LTD. USED IN METAL PLATING INDUSTRY. 100% NEW.
HS-Code
Products
382499990000
F300-0705 # & ZN-208HN ADDITIVES: USE STABLE (NOT CARBONATE POWDER WITH STEARIC ACID COATED PRODUCED FROM GROUPS OF HEADING 25.15 WITH PARTICLE SIZE UNDER 1MM) # & JP
382499999000
F300-0710 # & ADDITIVES TRN-988S1: USE COLOR PASSIVE (NOT CARBONATE POWDER WITH STEARIC ACID COATED PRODUCED FROM THE TYPE OF STONE GROUP 25.15 WITH PARTICLE SIZE UNDER 1MM) # & JP
382499999000
F300-0711 # & ADDITIVES TRN-988C1: USE COLOR PASSIVE (NOT CARBONATE POWDER WITH STEARIC ACID COATED PRODUCED FROM GROUPS OF GROUPS 25.15 WITH PARTICLE SIZE UNDER 1MM) # & JP
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